Ball bonder
TPT Wire Bonder, Franz & Fabian Hickmann GbR
Thermosonic 90° Wire Bonder
Wedge- Ball and Bump Bonding
17µ to 50µ Gold Wire Ball Bonding
17µ to 75µ Gold and Aluminium Wire Wedge Bonding
25µ x 250µ Ribbon Bonding
Digital Control with 4,3 TFT Colour Display
Storage 20 parameter Sets
Independent Control of first and second bond parameters
90° Deep-access Bond Head, Bond arm length 165 mm
PLL Ultrasonic generator ,
Stitch bonding
Heater stage & Tool Heater Controller
Manual Z Bond Head ,
Manual Wire Spool Holder
Motorized Wire Clamp
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