Micro-welder: wedge bonder
TPT Wire Bonder, Franz & Fabian Hickmann GbR
for 17µ to 50µ Wire and 25µ x 200µ Ribbon
90° Bonding Deep-access
Bond arm length 165 mm
Motorised Z and Y
Loop Height programable
Stitch and bump bonding
100 Program storage capacities
Built in Dual Fiber Optic illuminator
Built in Heater stage Controller
Motorised 2” Wire Spool
PLL Ultrasonic generator
6 : 1 ratio X-Y manipulator
Electronic ball size control
Semi-automatic and manual bonding
