for 17µ to 50µ Wire and 25µ x 200µ Ribbon 90° Bonding Deep-access Bond arm length 165 mm Motorised Z Loop Height programable Stitch and bump bonding 20 Program storage capacities Built in Dual Fiber Optic illuminator Built in Heater stage Controller Motorised 2” Wire Spool PLL Ultrasonic generator 6 : 1 ratio X-Y manipulator Electronic ball size control Semi-automatic and manual bonding