for the microelectronics industry
Plasma Enhanced Chemical Vapor Deposition (PECVD) System with a Vacuum Loadlock
The Minilock-Orion III is a PECVD system with a vacuum loadlock that produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. The system meets all safety, facility and process requirements within the laboratory and pilot line production environments. The Minilock-Orion III has many standard features not typically found on a system so reasonably priced, which is why many users worldwide have made it their PECVD system of choice.