BGA socket Tyco Electronics Thermal Solutions

0.5 mm BGA Sockets Overview

Tyco Electronics' 0.50 mm LGA/BGA Sockets utilizing HXC125 technology optimizes socketing fine pitched devices. This solderless, compression mount interconnect features a .030" tall contact with an .011" diameter mating surface. The compression load is designed to 25 grams per contact. This light load limits the stress applied to the substrate.

A hardware system is required to generate the necessary forces on the contacts. Tyco Electronics offers a complete hardware solution for each socket size.

Fully arrayed matrixes are available in sizes up to 60 x 60 contacts.

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