Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions.
