Flip-chip die bonder
max. 400 °C | PP5 unitemp GmbH

for the following applications: Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.
Standard Applications: MEMS, MMIC, Opto or IR Sensor, Laser diodes, strength gage

Model: PP5 with table on the top
Accuracy: Up to 5 µm, Up to 1 µm (option flip)
Die size: minimum 200*200 µm, maximum 50*50 mm
Substrate size: Up to 150x500 mm
Part fixture: by vacuum or clamp
Motorized Tables: X 240 mm , Y: 90 mm , Manual theta.
Speed: by joystick.
Table resolution 1 µm
Alignment: Manual with color CCD
Digital Target generator
Optical Zoom X12
Direct placement
2 references points for auto-centering placement
ndexed Pick and Placement mode
Parameters: On LCD screen
Bond force: Programmable 10g up to 3 000 g
Bond Time: Programmable 0 up to 999 s
Scrub: X Y and number
Vacuum: Selectable on or off during bond
Temperature: Programmable 0° up to 400°(option eutectic)