Plasma cleaning machine
max. 600 W | PTP-300
unitemp GmbH
Applications:
* Activation, cleaning and coating of surfaces
* fast ramp up heating of substrates and wafers
* fluxless soldering
* flip chip processing
* adhesive bonding
* Solder bump reflow
* Soldering of power devices
* small series production and prototype development
Technical Data PTP-300:
Loading area: 309mmx319mmx35mm (process area)
Chamber height: 35 mm
Chamber material: aluminium
Chamber material (optional): Quartz glass process chamber (size: 305x305x26mm)
Dimension outside: 600mmx1850x880 mm (WxDxH)
Chamber: integrated gas inlet / 2 gas lines are standard
Gas lines: 2 Mass Flow Controllers
Vacuum: DN25 KF vacuum flange
Heating: 12 infrared lamps 1,5 kW each, total 18kW
Process control by: SPS Controller PP220 (B&R) with LCD display
RS-232: RS-232 interface for PC control and data readout
Maintenance: integrated analog modem for remote diagnosis
Microwave generator: for plasma cleaning or removal of oxyde resists
2,45 GHz, max. 600 Watts
stepless from 100 Watts to 600 Watts
Cooling: water cooling required (water cooler optional)
Power: 3/N/PE; AC; 50/60 Hz; 230/400V
Weight: 150-200kg (depends on acessories
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