Semi-automatic wire bonder
max. 250 °C | WB-100 unitemp GmbH

The WB-100 was designed as a multipurpose semiautomatic wire bond tool for R&D purposes and small series production.

Its bench top size allows easy transport and operation. There is one bond head available for wegde/wedge, ball/wedge and bump bonding mode. There is no hardware change necessary. Direct access and simple adjustment to all bond parameters and programs allow easy handling of the tool.

Options and accessories:
- HPR-90 heated work holder 90 mm diameter, 360° rotatable
- HP-100 heated work holder 100 x 100 mm
- HP-150 heated work holder 150 x 100 mm
- HP-200 heated work holder 200 x 150 mm
- TH-TC Tool heater with thermocouple

Ultrasonic system: PLL control 62 kHz transducer
Ultrasonic power: 0 - 2 watt
Bond time: 15 - 5000 msec.
Bond force: 15 - 100 cN
Ball bonding tool: 1,58 (dia.) x 19 mm length
Gold wire diameter: 17 - 50 µm
Motorized Z travel: 20 mm
Throat depth: 165 mm
Fine table motion: 20 mm
Mouse ratio: 6:1