Lubricated vacuum system RVS-210

industrialcompact

The RVS-210 Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas. The reflow solder system is perfect for the following applications: soldering with flux and with other contaminating material flip chip process adhesive bonding solder bump reflowing encapsulation of housings soldering of power devices heat treatment of semiconductor wafers prototype development quality control Technical Data: heated area: 210 mm x 210 mm chamber height: 50 mm (optional up to 80 mm) viewing window with 60 mm dia. Mass Flow controller for Nitrogen (5 nlm) vacuum atmosphere up to 10exp.-3 hPa (KF16 connector) temperature up to 400 °C (optional up to 500 °C) ramp up rate: better 120 K/minute ramp down rate: better 120 K/minute SIMATIC© process control with 50 programs and 50 steps each 7" touch panel water cooled chamber (controlled and watched) electrical connection type: 230V, 9 kW or 115V, 7 kW