Reflow soldering oven RSS-210-S

semi-automatic

Vacuum Reflow Solder System The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas. The reflow solder system is perfect for the following applications: flux-less soldering flip chip process adhesive bonding solder bump reflowing encapsulation of housings soldering of power devices heat treatment of semiconductor wafers prototype development quality control Technical Data: heated area: 210 mm x 210 mm (= model RSS-110-S) chamber height: 60 mm (optional up to 80 mm) viewing window with 60 mm dia. Mass Flow controller for Nitrogen (5 nlm) vacuum atmosphere up to 10exp.-3 hPa (KF16 connector) temperature up to 400 °C (optional up to 500 °C) ramp up rate: better 240 K/minute ramp down rate: better 120 K/minute SIMATIC© process control with 50 programs and 50 steps each 7" touch panel water cooled chamber (controlled and watched) electrical connection type: 230V, 9 kW or 115V, 7 kW