MX2000IR Highly accurate fully automatic wafer inspection with handling unit Application areas For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection for surface purity and evenness. Checking for defects beneath the surface is also especially important, as is measurement of features such as die bonds, active areas, dimensions and sealing glue on MEM components (e. g. sensors). The automatic Viscom inspection system MX2000IR brings a 100 % inspection to all safety-critical components, with the wafers automatically loaded and unloaded by a handling unit. Highlights - Infrared illumination - transmitted light and reflected light - Very high resolution - High throughput - Complete inspection of the wafer - Barcode/OCR reading - Wafer pre-alignment - Automatic loading and unloading