Rising quality requirements, especially in the automobile industry, in aerospace and aeronautics, and in medical technology, often call for inspection of concealed areas in electronic or mechanical components. For this reason, more and more concerns are turning to microfocus X-ray inspection for non-destructive testing. These X-ray systems are used not only for small-series and prototype production, for optimizing process development, and for random-sample testing in production lines with a high throughput, but also for 100% inspection within production lines. A special highlight of the X-ray product range is the system line for combined inspection of printed circuit boards populated on one or both sides, which combines the time-proven visible light inspection method with the benefits of microfocus X-ray technology. The X7056 enables a high-performance 3-D X-ray inspection with parallel inspection of the top and bottom sides, to meet requirements for high throughput. This configuration allows reliable testing of concealed components and solder joints, for example in SMD, BGA and THT subassemblies.