Thin-film chip resistor
VISHAY
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
* Wire bondable
* Only one wire bond required
* Small size: 0.020 inches square
* Resistance range: 10 Ω to 1 MΩ
* Oxidized silicon substrate for good power dissipation
* Resistor material: Tantalum nitride, self-passivating
* Moisture resistant
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
