Epoxy resin HB 300

sealingfor bondinghigh-temperature

WEICON HB 300 is pasty, steel-filled and high-temperature-resistant up to +200°C (392°F) (up to 280°C/536°F for a short period of time). It is processed with a mixing ratio of 1:1. The epoxy resin system is also suitable for applications on vertical surfaces and can be used for the repair and bonding of cast and metal parts, for filling in blow holes, for repairing damage on containers, carriages and machine parts and for sealing pumps and pipes. The product can be used in mechanical and plant engineering, in equipment engineering, and in many other areas of industry.