Memory Multi-Chip Packages (MCP) We are a leader in memory solutions and developer of multi-chip packaging with a goal to provide high density, high performance MCPs. With our versatile memory products we can provide very high density in a very small space by using our available MCP technology, providing more headroom for your applications. Our multi-chip packages can be viewed as standard single-chip modified to accommodate the multiple ICs which provide the user with much higher functionality integration. Most MCPs typically incorporate 2 to 9 die and are packaged in conventional BGA, CGA, QFP, PGA, or PLCC. MCPs are available with DDR2, DDR, SDRAM, SRAM and Flash technologies in a variety of densities and organizations.