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Infrared laser cutting machine QAC&BACL, LDCfor plasticswaferCNC
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Characteristics
- Technology
- infrared laser
- Material
- for plastics
- Product handled
- wafer
- Control type
- CNC
- X travel
250 mm
(10 in)- Y travel
250 mm
(10 in)- Cutting speed
Min.: 0.001 m/s
(0.003 ft/s)Max.: 0.15 m/s
(0.492 ft/s)- Laser power
20 W
(0 hp)
Description
Features:
1. Fast speed
2. High processing quality
3. good beam quality
4. no mechanical stress
5. minimize the collapse and microcrack of chips
6. Low operating costs
7. 100, 000 hours average trouble-free operation
8. high electro-optic conversion efficiency
9. Powerful software with proprietary intellectual property rights
10. easy operation.
Parameters:
1. Laser Wavelength:1064nm
2. Laser Power:20W
3. Positioning Accuracy:±4μm
4. XY Grating Ruler Resolution:0.1μm
5. Z Axis Accuracy:±1μm
6. Rotation Axis Accuracy:±20″
7. Repeat Positioning Accuracy:±1μm
8. Working Table Route:250mm×250mm
9. Max Cutting Size:4 inches
10. Cutting Width:30-50μm
11. Cutting Depth:80-120μm
12. Cutting Speed:1-150mm/s
Application:
1. single-table glass inactive diode wafer
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.