Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over
traditional leadframe packages.The exposed die attach paddle enables efficient thermal dissipation when directly soldered to the PCB.
Additionally, this near chip scale package offers improved electrical performance, smaller package size, and an absence of external leads. Since the package has no external leads,coplanarity and bent leads are no longer a concern.