Dual in-line package (DIP) connector
2.54 mm | IC37 series
Yamaichi Electronics
Dual wipe contacts ensure high reliability
Low costs due to selective gold plating
Applicable for IC packages and side braze packages
Ideal for automated burn-in
General Specifications
Insulation Resistance: 1,000Mmin. at 500V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 20m max. at10mA / 20mV max.
Current Rating: 1A max.
Operating Temp. Range: -40°C to +170°C (PPS)
Mating Cycles: 25,000 to 50,000 insertions
Materials and Finish
Housing: Polyphenylenesulfide (PPS), glass filled
Contacts: Beryllium Copper (BeCu)
Plating: Au over Ni
