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semiconductor resin
semiconductor resin
GAR, FAiRS series

The ArF (193nm) is a high resolution imaging system that includes positive dry and immersion imaging and negative tone development. The GAR series are suited with a wide array of applications requiring 193nm dry exposure.

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Fujifilm NDT Systems
semiconductor resin / high-resistance / high thermal stability
semiconductor resin
GKR series

The Gkr series, which are manufactured by Fujifilm, are positive tone, KrF photoresist systems that have been developed to provide efficient, and reliable quality performance. It does not contain any PFOS or PFAS materials. It also has ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin
OiR, GiR, HiPR, FHi series

The Mid-UV range of sensitive photoresists is specifically created for various critical and non critical fields of applications. It is ideal of fields having a sub-0.30µm to >1.0µm resolution on different substrates under a substantial ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin
FEP, FEN series

Fujifilm e-Beam is a negative and positive tone resist series suitable for a variety of e-beam imaging requirements. Advantages include high resolution and wide process window. FEP series is a perfect one to be used with positive imaging ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin

Fujifilm has an aqueous buffer coat formulations which result to durable polymer coatings after thermal curing. It is photo-imageable using the g-line, i-line or other broadband exposure tools. They are developed with standard 0.262N ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin
Durimide 7000 series

The Fujifilms Solvent Developable Polyimide is a range of photo-imageable polyimide precursor which is ideal for a broad spectrum of applications in different substrates. It is created and improved through the our HTRD2 developer. It ...

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Fujifilm NDT Systems