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PCB testing machine Agilent Technologies
Agilent offers leading board test solutions for electronics manufacturers to tackle a wide...
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Flexible assembly machine DCAM-XS DEPRAG SCHULZ GMBH u. CO.
For assemblies in the smallest of work areas - the new DCAM-XS is a giant achievement! The DCAM-XS fulfills al market requirements for the most-modern micro-assembly machine: It is extremely small, fast, precise and flexible. Extreme small dimensions and unparalleled short module-refit times, are some of the exceptional characteristics of these flexible assembly machines. Screwdriving,...
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Laser-based wafer sorter / marker CORNING
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufactures. The Tropel UltraSort is a fully automated, non-contact metrology...
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SMD rework station IR / PL 650 Ersa GmbH
The IR/PL 650 is ERSA's flagship rework machine affords the highest degree of automation in the ERSA rework line and was specifically...
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Brazing paste dispensing gun FE-71 Fusion Incorporated
Pistol-Grip Attachment allows paste to be applied manually to copper and brass assembly Compressed air from control panel is introduced to upper gun body, forcing circular...
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Flexible assembly machine BIMERIC BM series Bihler
The innovative, modular NC production and assembly system BIMERIC BM 1500, BM 3000, BM 4500, sowie BM 306 offers users added flexibility and incredible vertical...
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Laser stencil cutting machine StencilLaser P 6060 LPKF Laser & Electronics
The LPKF StencilLaser P 6060 cuts stencils at the push of a button. LPKF’s StencilLaser P 6060 is a state-of-the-art...
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Flexible printed circuit board drilling machine OTS DEK Printing Machines Ltd
If you need substrate clamping without compromise, look no further than our Over Top Snuggers (OTS) technology. Securing printed circuit boards firmly in place ready for processing, the flexible technology is designed to ensure high quality printing for enhanced...
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Flexible assembly machine MicRohFlex® Pematech Rohwedder
New developments, new requirements, new challenges? Here comes the idea that will arm you with previously unconceivable degrees of freedom: Rohwedder's...
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Flexible assembly machine G05™ Mikron Assembly Technology
THE MIKRON G05™ – HIGH VOLUME PRODUCTION SOLUTION: FAST AND FLEXIBLE The linear assembly cell Mikron G05 is based on the use of standardized building blocks which offer flexibility and modularity. The platform makes use of a cam drive for all primary...
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Wire stacker WireStacker 3100 Schleuniger
The WireStacker 3100 is a modular high-performance wire stacker for the precise, axial stacking of cables. The...
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Automatic solder paste mixing machine 120 ml | UM-113S Japan unix
Impeller-less mixing/defoaming mixer Uni-cyclone UM-113S The most suitable for mixing and defoaming of small valume...
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Automatic SMT pick & place machine 2 000 - 3 000 p/h | QM2100 SMT MAX
• One Y-direction servo motor, rather than two, overcomes misalignment problem; air actuate feeders instead head-punch in advance feeders • 2000-3000 estimated pph(parts per hour) • 16" x 14" working area (QM2100) • Placement of 0402 standard (upgrade for smaller parts) • Computer vision automatic centering system for IC's...
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SMT pick & place machine LD812V Autotronik
True 'Vision On the Fly' Alignment ◎ Fiducial recognition and coordinate correction ◎...
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Screen printing machine for electronic industry max. 400 x 300 mm | VS series Aurel Automation
AUREL VS1520A Screen-stencil printer for high quality fine-line and fine-pitch printing on Ceramic substrates, LTCC, PWB, WAFERS,...
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SMT pick & place machine 21 000 cph | COBRA Essemtec AG
Leading edge engineering technology, the most feeders per sqm in the marketplace, intelligent feeders and set up concepts,...
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SMT pick & place machine 10 500 cph | Flexys Europlacer
Combining all round capability with outstanding value for money the Flexys-10 is perfect for low to medium volume high-mix...
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Manual die bonder FINEPLACER® pico ma Finetech
The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used...
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Semi-automatic BGA rework station APR-5000-DZ-ML OK International
Design and functionality come together in the compact and powerful APR-5000-DZ Advanced Package Rework System. This system provides closed-loop control, optimized vision and precise component placement on a compact platform of 19" x 30" (483mm x 762mm)....
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Flexible assembly machine max. 45 p/min | VarioCell OKU Automatik
VarioCell - Classical - Innovative - Flexible Flexible - The loosely circulating work-piece pallets - Individual pallets are advanced by...
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Fully-automatic ultrasonic flip chip die bonder FC300R SET
The FC300R is an automated version of the basic model of the High Force FC300; it addresses the needs of the pre-production environment. The FC300R offers production capabilities for Chip-to-Substrate or Chip-to-Wafer...
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Flexible assembly machine ø 125 - 1250 mm | Fittingshaper 1250 SPIRO INTERNATIONAL
The Fittingshaper contributes vitally to reduce the leakage rate in...
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Wire bonder 30 - 1100 g | MWH 1000 Sunstone Engineering
Sunstone's New MWH1000 Weld Heads provide the ability to perform precise, low inertial welds. These Micro Weld Heads are designed for delicate parallel gap welds such as thermocompression bonding, and reflow soldering. A compound lever force system ensures accurate, repeatable welding force ranging...
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The machines combine high production capacity and versatility at a reasonable cost. They are perfectly suited for low cost LED placement...
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SMT pick & place machine P1 Mechatronic Systems
Placement area: - max. 400x500mm Component range: - from 0402 to 25x25 ( option 40x40 ) - min pitch 0,4mm - BGA / µBGA components packgage: - tapes / sticks / trays / bulk Components centering: - non-contact alignment Placement rate: - up to 800 cph. Feeder capacity: - max...
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PCB marking machine Gen4 Control Micro Systems
The award winning, fourth generation of Control Micro Systems industry leading PCB laser marking systems introduces significantly improved...
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Wafer spin coater max. 300 mm | ACS300 Gen2 Suss MicroTec
The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing for 200 and 300mm wafers without mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming,...
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Component tinning robot TP 60P FTM TECHNOLOGIES
Automatic tinning. The TP 60P allows premium quality results thanks to its adjustable parameters.Principle : This robot allows the transport of components during tinning, gold and enamel removal or fluxing...
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Automatic SMT pick & place machine 3 000 - 3 500 p/h | PX3700 Madell Technology Corp.
Specifications: * 3000-3500 estimated pph(parts per hour) * 21" x 29.5" working area (PX3700) * Placement of 0402 standard (upgrade for smaller parts) * Computer vision automatic centering system for IC's (SOP, QFP, BGA) and better placement of small parts, software fly vision centering, included...
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Screen printing machine for electronic industry NSP-1T Yulishih Industrial Co., Ltd.
The Desktop Mini Slippery-Platform Screen Printer NSP-1T《Machine type: Screen Printer》equips with cylinder-transmission fixture module, and mechanism adjustment is intimate and creative,...
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Swing rotary magnetron Sputtering Components, Inc.
The SCI Short Bottom Mount Swing CathodeTM; uses...
