Other machines for the electronics industry

178 companies | 477 products
bonding system
bonding system

Flawless bonding, drying and transport. The Double Facer from BHS Corrugated does it all – from micro-flute to heavy triple-corrugated board. How productive your corrugator is largely depends on the performance of your Double Facer, especially ...

bonding system
bonding system

Hand-Held Systems for Ultrasonic Plastic Bonding & Cutting Hand-held welding and cutting units allow for exceptional control and accuracy Ideal for cutting and bonding delicate plastic components, lightweight synthetics, nonwovens ...

wafer mask aligner
wafer mask aligner

The LPA series prealigners are innovative, high precision, class 1 compatible prealigner solutions with integrated scan electronics. The Prealigners are designed and manufactured by Logosol, Inc. USA and isel Germany AG is the exclusive ...

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ISEL France
electrostatic charge remover
electrostatic charge remover
17040

The Nex Flow™ Ion Blaster Beam™ neutralizes static electricity and can remove static charge on a statically charged part and blow off dust up to 15 feet (4.6 m) away with no moving parts. Its compact design allows it to be used in hard ...

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Nex Flow Air Products Corp.
bonding system
bonding system
CBS 15

APPLICATIONS The semi-automatic Cap Bonding System CBS 15 fastens threaded end pieces on to the clip-pak® packaging units, which can be afterwards manually fitted with extrusion nozzles and closures (e.g. end caps, pegboard/Euro hanger ...

bonding system
bonding system
FOG

This equipment is used for general glass, special-shaped glass. The main functions are as follows: 1) After discharge of the COG Bonding device;2) A device with Edge Clean (option), ACF attachment, FPC (COF) false pressure and FPC (COF) ...

electroplating line
electroplating line

Electroplating is used for the finishing of technical or decorative surfaces. At Micro + Hega Surfaces you will find systems for all types of electroplating, such as gold plating silver plating chrome plating zinc plating copper ...

laser marking machine
laser marking machine
FLM

Laser is used to mark characters and barcode types on PCB or objects Feature . PC Control . Smema Communication . Marking Speed : 250 text/sec . Light Output : 20W . Wave Length : 1064nm . Precise positioning with servo ...

wire winding machine
wire winding machine
WM series

Automatic winding machines are used both in electric motor repairs and in serial manufacturing, for example in the production of large motors. SCHLEICH offers an extensive range of PC-controlled automatic coil winding machines for different ...

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Schleich GmbH
tinning machine
tinning machine

Advantages Formation of an intermetallic phase between the tin and the copper-based strip without any additional reflow process Finish with preferred tin whisker mitigation practices according to iNEMI-Recommendations, 12-1-06 ...

bonding system
bonding system
MBM 5000

It is a manual bonding machine designed for prototyping and small series that allows high precision and high technology in bonding with a very limited investment. The machine puts no technological limits to the kind of boards you need ...

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Piergiacomi Sud Srl
laser trimming machine
laser trimming machine
LTS series

Laser Trimmer 1.Creative use of customized fiber laser instead of traditional solid laser to provide the highest cost-performance 2.Self-designed measurement / control system with independent intellectual property rights 3.Proprietary ...

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JPT Opto-electronics
electrostatic charge remover
electrostatic charge remover

Ionization Chamber are manufactured with the cutomized design of anti-static bars, especially designed for the static elimination of flowing particle materials. In Industry raw material can mostly not be used only itself, it is generally ...

bonding system
bonding system

This machine is the deeply processing equipment of EPE foam sheet/film products, mainly used for the adhesive bonding and thickening of EPE foam sheet/film, increasing the intensity and thickness, widely used for the packing of electronic ...

wafer dicing saw
wafer dicing saw
139

0 Multiple sizes available Mainstream 812" ceramictable(Optional) . 03 High configuration Standard image recognition.Standard NCS (non-contact setup) function. 02 High standards Comply with international standards,high precision ...

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MEGAROBO
exposure system
exposure system
YD-FP912

Exposure Machine ◆ PHILIPS exposing system ◆ Efficiency vacuum system ◆ Customizable as special products YD-FP912  Exposure Machine ◇  Automatic mechanical device to open and close the cover.  ◇  PHILIPS exposing system, durable ...

automatic gluing device
automatic gluing device
RC-D-6-3-R/D

6-axis Gluing Robot Item No.: RC-D-6-3-R/D Robot glue dispensing machine For the sealing of 3D automobiles, lighting and so on Description: 6-axis Gluing Robot It consists of 6 DOF robot, automatic feeding system, automatic working ...

bonding system
bonding system

High class bonding for plastic parts by Schmidt & Heinzmann. The key element of the system consists of the heatable bonding tool. A shuttle table ensures a convenient component loading of the bonding tool from the pressing unit. The ...

soldering hot plate
soldering hot plate
C106

Toggle Plate Suit Metso Nordberg Jaw Crusher C106 Spare Parts Hyton supplies one-stop service for jaw crusher spare and wear parts, mainly includes: Pitman , Side Plate , Cheek Plate ,Toggle Plate , Flywheel , Wedge , Bearing , Eccentric ...

bonding system
bonding system

Logitech’s WSBU Wafer Substrate Bonding Units are premium bonders for the processing of fragile semiconductor wafers such as silicon and gallium arsenide. The bonding units are designed to minimise breakage with these expensive materials, ...

wafer spin coater
wafer spin coater

There are several options, from standard spin coaters to fully integrated solutions with dispensers.

diamond wire cutting machine
diamond wire cutting machine
DW 292-300

Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s

The DW292-300 is specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well ...

ion sputtering source
ion sputtering source
MERKURION-35-PRO

Category - MERKURION® pro Item description - Ion Getter Pump, Diode pump element style (positive polarity) with inlet flange DN 40 CF and nominal pumping speed 39 l/s. Electrical connector 10 kV SHV (compatible with SAFECONN) at voltage ...

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VACOM
scoring cutting machine
scoring cutting machine
G-S-K

X travel: 2,600 mm - 3,600 mm
Y travel: 1,500 mm

The 6-axis technology allows complex components to be machined intelligently and with particular accuracy. The high production accuracy is a winning factor in industry sectors such as the automotive supply industry. Application possibilities ...

bonding system
bonding system
DeltaBond

Delta Bond series equipment is suitable for all steps in the optical bonding process. This includes precision dispense, fill, image corrected pick and place, and bonding of optical devices. It is an ideal solution for use with optically ...

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PVA
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