Ansys Icepak provides powerful electronic cooling solutions which utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). This provides a CAD-centric solution for engineers who can leverage the easy-to-use ribbon interface to manage thermal issues within the same unified framework as Ansys HFSS, Ansys Maxwell and Ansys Q3D Extractor. Electrical and mechanical engineers working in this environment will enjoy a completely automated design flow with seamless coupling from HFSS, Maxwell and Q3D Extractor into Icepak for steady-state or transient thermal analysis.
Engineers can rely on Icepak for an integrated electronics cooling solution for electronic applications ranging in scale from individual ICs to packages and PCBs, up to computer housings and entire data centers. The Icepak solver performs conduction, convection and radiation conjugate heat transfer analyses. It has many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Icepak provides a vast library of fans, heatsinks and materials to furnish solutions to everyday electronic cooling concerns.