Industrial simulator Icepak

CAD/CAMnetworkcustom

Overview
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics using the Ansys Electronics Desktop (AEDT) GUI and the Ansys Fluent CFD kernel.

Core capabilities

• Unstructured, body-fitted meshing
• Comprehensive thermal reliability solution
• High-fidelity CFD solver (Ansys Fluent)
• Multiscale, multiphysics coupling
• MCAD and ECAD support
• Solar radiation modeling
• Parametrics and optimization
• Customization and automation (scripting/API)
• Network modeling
• DC Joule heating analysis
• Electro-thermal and thermo-mechanical coupling
• Extensive thermal libraries
• Liquid cooling modeling
• Dynamic thermal management and ROM for varying flow and power

Technical features
Perform conduction, convection and radiation conjugate heat transfer analyses. Support for laminar and turbulent flows, species and radiation models, DC Joule heating, electro-thermal and thermo-mechanical interactions, and reduced-order models (ROM) for transient or multi-parameter scenarios.

Applications

• IC packages and chip-level cooling
• PCB thermal analysis and component-level cooling
• Electronic enclosures and rack cooling
• Power electronics and converters thermal design
• Heat sink, cold plate and liquid cooling system design
• Thermal reliability and lifetime assessment
• Airflow optimization and ventilation design

Integration & workflow

• AEDT GUI with Fluent solver integration
• MCAD and ECAD import/export
• Parametric studies and automated optimization
• Customization via scripting and APIs
• Network and co-simulation modeling
• Exportable reports, libraries and ROMs for system-level use