Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.
3/4" (19mm) thick aluminum heat plates for precise, even heating
Temperatures up to 315°C (600°C) for soldering with lead-free solder alloys
Lead and Lead-free compatible