Soldering oven GF-B-HT
chambergasnitrogen

soldering oven
soldering oven
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Characteristics

Function
soldering
Configuration
chamber
Heat source
gas
Atmosphere
nitrogen
Other characteristics
stainless steel, PCB
Maximum temperature

315 °C (599 °F)

Description

Cost-effective mini-sized batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand. It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money. This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow. Low-cost reflow oven best for small batch runs and prototypes. Large window allows the operator to see the board throughout the entire reflow process Unique shuttle system enables higher throughput than standard batch ovens All stainless steel interior construction provides for years of useful life Nitrogen gas inerting option available Maximum board size is 12" x 12" (305mm x 305mm) Compatible with lead and lead-free soldering applications
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.