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Position measuring system SPI
volumethicknessspeed

Position measuring system - SPI - ASM Assembly Systems - volume / thickness / speed
Position measuring system - SPI - ASM Assembly Systems - volume / thickness / speed
Position measuring system - SPI - ASM Assembly Systems - volume / thickness / speed - image - 2
Position measuring system - SPI - ASM Assembly Systems - volume / thickness / speed - image - 3
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Characteristics

Measured physical value
thickness, position, volume, speed
Technology
optical, 3D, 2D
Operating mode
automatic
Measured material
for PCB
Applications
control
Other characteristics
smart

Description

The Process Lens high-end 5D SPI system offers an unprecedented combination of speed and precision, and thanks to the use of powerful state-of-the-art algorithms, it understands exactly what it measures and knows how to interpret the results. • Innovative: DLP chips with 8 or 20 million micromirrors (standard and HD version, respectively) produce absolutely distortion-free Moiré patterns • Fast and reliable: Up to 70 percent shorter inspection times and up to 80 percent fewer false calls compared to traditional SPI systems. • High precision: With a resolution of down to 10 µm, speed and precision are no longer mutually exclusive with the Process Lens. • Measures what matters: The Process Lens measures paste deposits, glue, contamination, dust, and a whole lot more – all while suppressing any measurement noise generated by the PCB. Smart measurements ensure top-quality prints With its highly flexible portfolio of services ranging from SMT to THT production to module inspection and testing, ESCD GmbH is committed to constant expansion. Since the company supplies many well-known industrial companies and wants to gain an even stronger foothold in the aviation sector, its manufacturing equipment is versatile and flexible. For high-mix/low-volume jobs, the solder paste printing process is particularly challenging because the results depend to a large extent on fluctuating environmental factors such as temperature and humidity. Frequent product changeovers can also cause faults in the solder paste application. And since reqorking products is not an option, detecting faults early and without affecting the throughput is critical to success.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.