Automatic stencil printer DEK Galaxy

solder pasteSMT

The DEK Galaxy printer delivers exceptional performance, flexibility, and maximum precision (±12.5 μm @ 2cmk), all with a fast 7-second cycle time. Designed to meet diverse production requirements, it enables seamless transitions between wafer bumping with solder paste printing, SMT pre-assembly for next-generation assemblies, and DirEKt Ball Attach on wafers or substrates with ball diameters as small as 0.2 mm. With a range of configuration options, the DEK Galaxy is built for efficiency and precision. Singulated tooling systems allow for individual alignment and multi-substrate printing within a single cycle. JEDEC wafer chucks and carriers ensure smooth wafer and substrate processing, while Grid-Lok® and customized tooling provide advanced substrate support, even for high-density assemblies. Extensive flexibility: Wafer bumping by solder paste printing, SMT pre-assembly for next-generation assemblies or DirEKt Ball Attach on wafers or substrates with ball diameters down to 0.2 mm. Singulated substrate tooling: Allows for individual alignment and processing of multiple substrates within one print cycle (VPT / TRS / MASS) 3D Stencil printing: Capable of 3D stencil printing with AgS paste for power electronics packaging Maximum precision: Wet-print accuracy of up to ±17.5 µm @ 2 cpk High throughput: Core cycle time of 7 seconds High print quality: Leading to greater first pass yield Fast New Product Introduction (NPI): Fast setup and first print, easier operation and error prevention and correction