OverviewReliable, even support of the substrate is essential for repeatable printing and high line yield. ASMPT (DEK) provides a portfolio of custom, modular, automatic and manual carrier and tooling solutions to address a wide range of production requirements.
- Improved process performance
- Higher throughput and printer utilization
- Reduced changeover and operating costs
- Compatibility with multiple platforms
- Field-retrofittable options
Singulated substrates supportDEK Multiple Alignment of Singulated Substrates (MASS)DEK MASS establishes a standard for printing individual substrates in demanding applications such as smartphone panels and multi-part assemblies. It provides optical alignment and vacuum fixation for precise, high-throughput processing.
- Market-leading throughput
- Scalable design
- Optical alignment precision up to 12.5 µm @ 2 Cp
- Simultaneous alignment via movable tooling towers for short cycle times
- Vacuum fixation and surround plate for pressure optimization
- Retrofittable
DEK Topside Reference System (TRS)TRS supports processing of challenging devices (LGAs, BGAs, 01005 passives, 0.25–0.3 mm BGAs) using extreme edge alignment and virtual panel tooling concepts for high-throughput imaging of singulated substrates.
- Supports up to 72 singulated substrates
- Typical alignment accuracy ~30 µm @ 2 Cp
- Fast singulated substrate processing
- Proven on difficult device types
- Typical cycle time < 30 s
- Compatible with most DEK platforms; field-retrofittable
DEK Virtual Panel Tooling (VPT)VPT carrier and alignment system enables parallel processing of multiple individual substrates in a single cycle, maximizing UPH and printer resource usage.
- Up to 72 singulated substrates
- Typical alignment accuracy ~30 µm @ 2 Cp
- High-throughput multi-substrate solution
- Maximizes printer resource utilization
- Precise material imaging compared with dispensing
PCB standard supportFlex Support solutionFlex Support is a modular, adjustable base tower system that remains in the printer and adapts to multiple applications and platform types (including non-DEK). It offers quick play-and-play fastening without screws.
- Adjustable size range 80–300 mm
- Remains in the printer — one system for multiple applications
- Available for DEK Horizon, DEK NeoHorizon and DEK TQ
- Also available for third-party printing platforms
- Tool-free play-and-play fastening
Custom dedicated toolingApplication-specific tooling provides optimal substrate support and improved print quality through tailored design and robust manufacturing that minimize substrate movement and mis-positioning.
- Improved process control and safety
- Increased stencil life
- Reduced cleaning frequency
- Higher squeegee speeds
- Reduced short circuits and paste residue
- Minimized line downtime
DEK Support BarsQuick, manual support bars for single-sided PCB printing; operator-placed between conveyors for fast setup.
- Cost-effective for single-side prints
- Average setup time
- Operator placement
DEK Grid-Lok™DEK Grid-Lok™ GoldGrid-Lok Gold is an automatic board support with pneumatically-operated pins that adapt and lock to board topography to prevent movement and flex during printing and testing—suitable for high-mix environments.
- Process flexibility
- Reduced or zero changeover time
- Topography adaptation to eliminate component damage risk
- Reduces tooling costs
DEK Grid-Lok™ SilverGrid-Lok Silver provides robust, vibration-protected support with quick changeover and minimal operator intervention for placement processes.
- High versatility
- Unparalleled flexibility
- Minimal operator intervention
- Reduced or zero changeover time
DEK Grid-Lok™ spare partsSpare parts and consumables for long-term Grid-Lok use: ESD rubber top caps, pin repair kits, pneumatic connectors, controllers, board lifters and jigs.
- ESD rubber top caps
- Pin repair kits
- Pneumatic connectors
- Controllers and lifters
Applications focusSolutions cover both singulated-substrate printing and traditional panel processes, from manual support bars to fully automated Grid-Lok systems and field-retrofittable modules.
Technical specifications- DEK MASS: optical alignment precision up to 12.5 µm @ 2 Cp; vacuum fixation; surround plate; scalable design
- DEK TRS / VPT: support for up to 72 singulated substrates; typical alignment accuracy ~30 µm @ 2 Cp; fast cycle times
- Flex Support: adjustable 80–300 mm; play-and-play fastening (no screws)
- Grid-Lok Gold: pneumatically-operated pins, automatic adaptation and locking to board topography
- Grid-Lok Silver: engineered for robustness and vibration protection
- Solutions available as modular, automatic, manual and field-retrofittable systems