Thermal conductor temperature control unit A

coolingmodular

We offer a wide range of extremly performant, reliable temperature control systems for the semiconductor industry. The modular concept for convenient, cost effective system upgrades, highest safety of investment and easy customization. Core Technology Universal Chuck Design – one chuck for air- and liquid cooled systems Hybrid Chuck Design – operation with and without cooling unit Air Cooled High Temp Systems Hybrid Chuck usable for air- and liquid cooling The table below shows the overall specifications overview. Chuck performance may vary between different prober types and applications. Advanced Temperature Test Systems means best available components for our products and the most advanced manufacturing technology. Our products are designed for exceptional thermal and mechanical stability and precision. AddOn Technology Modular AddOn Stacks for various applications eWLB, HV/HC, LN, Plain, Caro, etc.. Low Thermal Resistance (LTR) Low Thermal Resistance (LTR) Technology MultiSense Technology High Accuracy Applications High Power Applications LTR High Accuracy Low Thermal Resistance Technology MultiSense with multiple temperature sensors Designed for low power and sensor devices Best temperature accuracy and uniformity LTR High Power Low Thermal Resistance Technology For high power and high parallelism devices High power dissipation @ wide temperature range IntelligentDry Air Control Active CDA purge control to reduce the dry air consumption Advanced dry air control to purge with two individual media Bonding pad protection Adaptive dew point control Thin/Warped Substrates Patented Bernoulli functionality for extremely thin wafers and substrates