Highly dispersive processing technology realizes precision polishing.
This sheet is suitable for polishing end faces of optical communication connectors and LCD display components.
High dispersion machining technology and compounding design technology enable high grinding power and high-precision finishing.
Features
Planarization at the nano- to angstrom level
Lineup of films and tapes of various abrasive grains as TOPX D (diamond), TOPX A (alumina), and TOPX S (silica)
Controlled surface structure of polished surfaces through binder design, advanced particle dispersion, and precision coating technology
Long life and high grinding performance due to autogenous action by unique surface/interface control