resistive strain gauge / for stress analysis / half-bridge / encapsulated
GB, GB(L), GB(AL), GB(BL)
for stress analysis, half-bridge, encapsulated
Min.: 350 Ohm
Max.: 3,000 Ohm
Gauge factor (k):
Min.: 1.86 unit
Max.: 2.2 unit
All the BCM class-A strain gauges are both temperature compensated for zero drift (STC) and creep-compensated to sensor body’s creep (creep code) Nevertheless, some particular EKF-series karma gauges possess the creep-compensation and temperature-compensation for sensitivity drift, so-called effective modulus gauges (EMC). The class-B strain gauges are developed for stress analysis, so some type of strain gauges is not encapsulated but open-faced gauges, like HA-D, HA-E, CC or CD gauges. Same as the class-A gauges, the class-B strain gauges are manufactured from either constantan- or karma-foil, and both the constantan gauges and the karma gauges are available with any of the six backing materials, that is, one of FEBIAG.
If the stress analysis is performed at high temperature (250 °C) or is performed under harsh environment, such as under water or elongation application, it is recommended to choose the gauges developed for water-proof or for elongation measurement.