Brush cleaning machine TWB-200

automaticfor surface treatmentfor the semiconductor industry

This machine is a fully-automatic wafer cleaning machine, automatically operated by a manipulator in a closed environment, has cleaning and drying functions, suitable for cleaning of various semiconductor substrate materials after polishing, and can effectively reduce particle contamination on the wafer surface. Complete functions With the function of cleaning and drying, operated by a manipulator in a closed environment, low risk, prevention of secondary pollution. Simple operation PLC touch screen control, manipulator automatically completes the automatic wafer cleaning process from cassette to cassette. Good compatibility Compatible with 2, 4 and 6 inch wafer Small floor space Minimize the floor space in the clean room.