Reflow soldering machine V8S
semi-automatic

reflow soldering machine
reflow soldering machine
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Characteristics

Technique
reflow
Operating mode
semi-automatic

Description

The RSS-3X210 is a compact reflow solder system. The unit is made for small budget and space purpose. The system is used on different solder processes and other types of applications. The device is applied on laboratory solder system on all types of developers. The chamber is hermetically sealed. The heated area of the device is 630mm x 210mm. It can be used on processing parallel devices up to 12 wafers with a diameter of 100mm. The maximum temperature of the device can reach up to 300°C. For an easy programming, the device uses a USB interface to PC.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.