The RSS-3X210 is a compact reflow solder system. The unit is made for small budget and space purpose. The system is used on different solder processes and other types of applications. The device is applied on laboratory solder system on all types of developers.
The chamber is hermetically sealed. The heated area of the device is 630mm x 210mm. It can be used on processing parallel devices up to 12 wafers with a diameter of 100mm. The maximum temperature of the device can reach up to 300°C.
For an easy programming, the device uses a USB interface to PC.