Reflow soldering oven FT03 ADVANCED
semi-automaticverticalmodular

reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
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Characteristics

Technique
reflow
Operating mode
semi-automatic, vertical, modular
Applications
for printed circuits, for electronic components, for small-scale production
Other characteristics
multi-zone, benchtop, compact
Power

2,000 W

Description

Basic model of batch ovens, the FT03.ADVANCED oven was designed for reflow solder paste and polymerization of glues for prototype cards. Controlled by SMTix 2.0 software Full view of the map through a large window Possibility to create up to 10 temperature increments Memorization of an infinite amount of programs Compact model but offering a working reflow area of 190 x 290 mm Heat distribution by forced convection, max. T ° 300 ° C Nozzle and suction pipe for connection to filtration unit (optional) Temperature control by microprocessor LCD display of the different setpoints: temperature and time Very simple programming for immediate handling Security: double glazing with air circulation, locking the access door This model exists in 2 versions. The standard FT03 and the FT03.ADVANCED oven witch is controlled by SMTix 2.0 software, a new version of SMTix.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.