The optimal laser source for brittle material cutting, as well as a flexible UV solution for micromachining, in a physically compact and economic design.
Rapid LX has a unique combination of pulse energy and operational flexibility for significantly reduced cost-per-part over previous generation USP lasers. It's ideally suited for brittle material cutting, micromachining in flat panel display and microelectronics processing.
Choose up to 250 µJ single pulse energy at 1064 nm, or 50 µJ at 355 nm, and work at repetition rates from single-shot to 5 MHz with excellent beam quality.