Leaf thermally conductive material TGP 7000ULM

- Thermal Conductivity: 7 W/m-K - High-compliance, low compression stress - Ultra low modulus BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. TYPICAL APPLICATIONS - Telecommunications (routers, switches, base stations) - Optical transceivers - ASICs and DSPs TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Hardness, Shore 000, ASTM D2240 75 Inherent Surface Tack 2 Density, ASTM D792, g/cc 3.2 Heat Capacity, ASTM E1269, J/g-K 1.1 Shelf life, days 180 Young's Modulus kPa 152 (psi) (22) Electrical Properties Dielectric Constant, ASTM D150, 1,000Hz 8.7 Dielectric Breakdown Voltage : 40 mil sample, VAC >5,000 Volume Resistivity, ASTM D257, ohm-meter 1.2×1011 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 7.0