Annealing furnace HICON
heat treatmentbellgas

annealing furnace
annealing furnace
annealing furnace
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Characteristics

Function
heat treatment, annealing
Configuration
bell
Heat source
gas
Atmosphere
vacuum
Other characteristics
for aluminum, for the electronics industry
Maximum temperature

Max.: 620 °C
(1,148 °F)

Min.: 550 °C
(1,022 °F)

Description

Aluminum foil for the electronics industry must fulfill the very highest quality requirements. Only the highest purity aluminum is used for manufacturing high-capacitance foil. The purity of the aluminum increases depending on the operating voltage. For low voltage applications grade AI3N8 is sufficient, while high voltages require AI4N (AI 99.99 %). An extremely pure process atmosphere is used during the anneal to achieve a uniform Al2O3 layer on the foil surface, which in turn benefits tunnel etching during subsequent processes. The material is processed at annealing temperatures between 550 °C and 620 °C, and the atmosphere dewpoint must be below -30 °C. To fulfill these strict criteria the anneal has to take place in a furnace with a retort that is both gas-tight and vacuum-tight. A HICON bell annealer is ideal for this application. HICON bell annealers are distinguished by the following features: Metallic surfaces designed for medium vacuum Flexible heating-up and cooling gradients in vacuum or process atmosphere Gas-tight and vacuum-tight workload space
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.