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High-accuracy lapping machine TSV
cylindricalpolishingportable

High-accuracy lapping machine - TSV - EFCO Maschinenbau GmbH - cylindrical / polishing / portable
High-accuracy lapping machine - TSV - EFCO Maschinenbau GmbH - cylindrical / polishing / portable
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Characteristics

Options
polishing, precision, for processing, high-accuracy, compact, portable, cylindrical
Applications
for thin sections, safety valve

Description

Transportable grinding machine for safety valves The EFCO TSV portable grinding and lapping machine is designed for machining sealing surfaces on safety valves. The drive mechanism includes an eccentric system that produces a superimposed grinding motion. This cross-pattern motion ensures flat sealing surfaces. The machine is suitable for valves with or without flanges and can be used both on-site and in a stationary workshop setup. Machining is carried out using standardized tools with a defined eccentricity of 3 mm, allowing for reproducible processing. Two models are available: TSV-150 for nominal sizes DN 15 to DN 150 with a pneumatic drive (operating pressure 6–7 bar), and TSV-300 for DN 25 to DN 300, available with either an electric (230/110 V, 50/60 Hz) or pneumatic drive. The maximum tool immersion depth is 350 mm. Centered tool guidance and consistent lapping paste distribution ensure high-quality machining results. The TSV is intended for maintenance and overhaul of safety valves in field operations or stationary repair environments.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.