thermally conductive gap filler
GF400 thermal gap filler is a two part, liquid silicone based thermally conductive material which cures at room temperature or can be accelerated using heat. It has exceptional thermal performance (4.0 W/m.K) and after curing GF400 forms a low modulus elastomer preventing the ‘pump-out phenomenon’.
As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application. For further information please refer to the product TDS, or get in touch with our Technical Support Team who are always on hand to ‘Talk Solutions’
Soft and compliant for low stress applications
Low viscosity; easy to dispense
High thermal conductivity
Low modulus elastomer, prevents 'pump-out'