Data connector 405-53112-51

SMTboard-to-boardEMC

12 pins unmated stacking height: 2.65 mm EMC shielding SMT 0.8 mm pitch Performance level 1 Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 12 Board-to-Board Distance - 7.5 mm to 15.0 mm Insulator Material - LCP, UL 94 V-0 CTI value IEC 60112 - 150 Contact Material - Copper alloy Plating - Au over Ni Termination area - Sn over Ni Mating Force per Pin - ≤ 0.5 N Separating Force per Pin - ≤ 0.4 N Durability IEC 60512-9-1 - 500 mating cycles Coplanarity - ≤ 0.1 mm Vibration, sinusoidal IEC 60512-6-4 - 10 - 2000 Hz, 20g Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 - ≤ 1 µs Shock, semi-sinusoidal IEC 60512-6-3 - 50g, 11 ms Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5