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Multilayer printed circuit board 12L
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Characteristics
- Options
- multilayer
Description
Key Features
*Layers: 12Layers
*Finished Board Thickness: 1.7+/-0.1mm
*Material:FR-4 High TG 170
*Surface Finish:Electroless Au/ Organic Solderability Preservatives
*Copper: H/H/H/H/1/1/1/1/H/H/H/H OZ
*Dielectric Layer: TG170 Prepreg
*Solder Mask: Green
* Remark: Blind Via: L1/L2& L2/L3&L9/L10&L11/L12
*Panel Size: 150mmX244mm
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.