Modular micro datacenter EXTRCOOL 20FT
containerizednext generation networks5G

Modular micro datacenter - EXTRCOOL 20FT - Extrcool Industry Limited - containerized / next generation networks / 5G
Modular micro datacenter - EXTRCOOL 20FT - Extrcool Industry Limited - containerized / next generation networks / 5G
Modular micro datacenter - EXTRCOOL 20FT - Extrcool Industry Limited - containerized / next generation networks / 5G - image - 2
Modular micro datacenter - EXTRCOOL 20FT - Extrcool Industry Limited - containerized / next generation networks / 5G - image - 3
Modular micro datacenter - EXTRCOOL 20FT - Extrcool Industry Limited - containerized / next generation networks / 5G - image - 4
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Characteristics

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modular, 5G, containerized, high-performance, artificial intelligence, next generation networks

Description

Product Overview
EXTRCOOL's 20 ft containerized liquid-cooled data center is a compact, high-density turnkey computing solution designed for AI, high-performance computing (HPC) and modern data center workloads. Housed in a standard 20-foot ISO container, the prefabricated unit integrates power, cooling, monitoring and safety to deliver thermal efficiency, energy savings and scalable performance in a space-saving footprint.

Universal NVIDIA Compatibility
  • Fully compatible with NVIDIA enterprise GPUs (GB300/GB200/B300/B200/H200) for AI, HPC and high-load workloads.
  • Advanced liquid cooling: direct-to-chip and immersion options reduce energy use, lower PUE and support continuous GPU operation.
  • Rapid plug-and-play deployment: factory-integrated unit (power, cooling, monitoring, safety) deploys in weeks with no major construction.
  • Versatile deployment: compact, high-density design suitable for edge computing, AI clusters, remote sites and temporary projects.


Core Advantages Over Traditional Data Centers
  • Rapid deployment: factory-built and pre-tested, deployable in weeks and relocatable to match changing requirements.
  • On-demand scalability: expand capacity by adding modular containers to accommodate growing AI and HPC workloads.
  • Cost efficiency: lower upfront and operational costs compared with conventional brick-and-mortar data centers, with reduced energy bills from liquid cooling.
  • Flexible deployment: installable at remote locations, rooftops, temporary sites and edge environments without major construction.
  • Superior energy efficiency: liquid cooling minimizes cooling power consumption and reduces environmental impact.


Core Integrated Components
  • Brand: EXTRCOOL
  • Power infrastructure: redundant PDUs and modular UPS systems for reliable, uninterrupted power delivery.
  • Thermal management: high-efficiency liquid cooling systems (direct-to-chip and immersion) for extreme heat dissipation.
  • Racking solutions: customized server racks optimized for high-density NVIDIA GPU deployments.
  • Fire safety: automatic clean-agent fire suppression systems for equipment protection.
  • Physical security: locked access doors, surveillance cameras and access control integration.
  • Intelligent monitoring: real-time monitoring and management platforms for visibility into data center health and performance.


Ideal Use Cases
  • AI and large-scale model training: power high-performance AI clusters for LLM training and inference.
  • High-performance computing (HPC): support scientific computing, engineering simulation and computational research.
  • Edge computing and telecommunications: deploy low-latency computing at the network edge for 5G/6G and IoT applications.
  • Remote and industrial environments: reliable operation in remote, harsh or infrastructure-limited locations.


Return & After-Sales Policy
  • Domestic buyers: eligible for return or exchange within 7 days of delivery subject to technical confirmation of product quality defects.
  • Overseas buyers: eligible for return or exchange within 15 days of delivery subject to technical confirmation of defects.
  • Transportation damage: damage during transit is not covered; claims should be handled with the freight carrier and supporting documentation provided.
  • After-sales eligibility: after-sales support provided to direct purchasers; orders via dealers or third parties must be serviced by the original seller.
  • Warranty validity: unauthorized disassembly, modification or repair voids the warranty; retain original packaging and labels to maintain coverage.


Technical Specifications
  • Brand: EXTRCOOL
  • Form factor: standard 20-foot ISO container
  • Compatibility: NVIDIA enterprise GPUs (GB300/GB200/B300/B200/H200)
  • Cooling technologies: direct-to-chip and immersion liquid cooling
  • Deployment: factory-integrated, plug-and-play; deploys in weeks
  • Power: redundant PDUs and modular UPS systems
  • Racking: customized high-density GPU server racks
  • Safety: automatic clean-agent fire suppression systems
  • Security: locked access doors, surveillance cameras, access control systems
  • Monitoring: real-time intelligent monitoring and management platforms
  • Primary use cases: AI training/inference, HPC, edge computing, remote and industrial deployments

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Liquid Cooling Container Data Center

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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