modular, 5G, containerized, high-performance, artificial intelligence, next generation networks
Description
Product Overview
EXTRCOOL 20ft containerized liquid-cooled data center is a prefabricated, high-density turnkey solution designed for AI, HPC and modern data center workloads. The system integrates power, cooling, monitoring and safety inside a standard 20-foot ISO container for rapid deployment.
Universal NVIDIA Compatibility
Full compatibility with NVIDIA enterprise GPUs (GB300, GB200, B300, B200, H200) for AI training, inference and HPC applications.
Advanced liquid cooling combining direct-to-chip and immersion technologies to reduce cooling power and stabilize GPU operation under sustained load.
Factory-integrated plug-and-play unit enabling site commissioning in weeks without major civil works.
Core Advantages Over Traditional Data Centers
Rapid deployment through factory pre-assembly and testing, enabling fast relocation and capacity changes.
Modular scalability: expand capacity by adding additional containers to match growing AI/HPC demands.
Lower total cost of ownership via reduced construction needs and improved energy efficiency from liquid cooling.
Flexible siting: deployable at edge locations, rooftops, remote or temporary sites where conventional facilities are impractical.
Improved energy performance with lower PUE due to targeted liquid cooling.
Core Integrated Components
Power infrastructure: redundant PDUs and modular UPS for continuous, reliable power delivery.
Thermal management: high-efficiency liquid cooling systems (direct-to-chip and immersion) engineered for extreme heat dissipation.
Racking: customized high-density server racks optimized for multi-GPU NVIDIA deployments.
Fire safety: automatic clean-agent fire suppression systems for electronic equipment protection.
Physical security: lockable access doors, surveillance camera support and access-control integration.
Monitoring: real-time monitoring and management platform for visibility into performance and health.
Ideal Use Cases
AI and large-scale model training: high-density clusters for LLM training and inference workloads.
High-performance computing (HPC): scientific simulations, engineering analysis and research computing.
Edge computing and telecommunications: low-latency compute for 5G/6G, telco and IoT edge applications.
Remote and industrial environments: reliable compute in sites with limited infrastructure or harsh conditions.
Return & After-Sales Policy
Domestic buyers: eligible for return or exchange within 7 days of delivery subject to technical confirmation of defects.
Overseas buyers: eligible for return or exchange within 15 days of delivery subject to technical confirmation of defects.
Transportation damage: transit damage must be claimed with the carrier; EXTRCOOL will assist with documentation.
After-sales support: provided to direct purchasers; units sold via resellers must be serviced by the original seller per local agreements.
Warranty: unauthorized disassembly, modification or repair voids warranty; retain original packaging and labels to maintain coverage.
Technical specifications
Brand: EXTRCOOL
Product type: Containerized liquid-cooled data center (prefabricated turnkey solution)
Form factor: Standard 20-foot ISO container
Cooling technology: Direct-to-chip and immersion liquid cooling
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.