Fancort offers 2 models of Hot Bar Bonding & Soldering machines which are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Click Here to view and compare the technical specs of both machines.
Features:
Microprocessor-based controller provides precise and consistent temperature control.
Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.
Flexible programmable profiles for targeted idle, preheat and reflow temperature.
Floating thermode and digital pressure control.
Manual shuttle of work; optional pneumatic shuttle.
NEW: Bonder machine uses conductive adhesive film (ACF) for very fine pitch devices. Click here for larger image.
Fancort can supply fixtures and thermodes
"Smarttherm" constant heat-type machine for heat seal applications