Laser cutting system

for PCBfor industrial applicationsprecision

Laser Cutting System is widely used in modern PCB/FPC industry. This laser cutting machine uses short wavelength laser (Ultra-violet) beam to scan the surface of the PCB, then the high-energy ultraviolet beam is in direct-affection to the surface of the molecular bonds of the flexible material. UV laser processing is "cold processing", the "cold" processing the target area of PCB/FPC with smooth edges and leave minimal carbonation on the board. This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser generator. This equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing. With sophisticated two-axis table and closed loop control module, it ensures fast cutting while maintaining micron magnitude of precision with modern technology of position sensors and CCD image capture application. Suitable Processing Materials Flexible circuit boards, rigid circuit boards, rigid-flex circuit board sub-board processing. Rigid, flexible circuit board sub-board processing component is installed. Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an acrylic film, a polyimide coating film. Thickness of 0.6mm or less precision ceramic cutting, dicing; variety of cutting the base material (silicon, ceramics, glass, etc.) Etching precision molding various functional films, an organic film and other precision cutting.