Probe card FeinProbe®

Probing WLCSP, SiP or flipchip wafers requires probes withstanding high current while simultaneously assuring high signal integrity. The FEINMETALL FeinProbe® addresses those applications with excellence. Min. pitch of the DUT - 150 µm Min. diameter of the plunger - 120 µm Max. contact surface - 80 mm x 80 mm Temperature - -40°C...+150°C Current carrying capability at RT - 2100 mA Contact force at rec. OD - 10 cN -18 cN Bandwidth analog @ -1dB limit - 100 GHz Material compatibilities - Material compatibility 1 - Gold Material compatibility 2 - Solder ball Material compatibility 3 - Copper