4U storage server platform supporting single AMD EPYC™ 9005 / 9004 Series processors (SP5 / LGA 6096) in a high-density chassis. Form factor: 4U (434 x 176 x 853 mm).
Optimized for dense block/object storage, caching and software-defined storage (SDS) deployments with combination of 3.5" bays and rear NVMe/service bays.
Key Highlights
Single AMD EPYC™ 9005/9004 series processor support (single-socket, cTDP up to 400 W).
High internal capacity: 60 x 3.5" internal hot-swap SATA/SAS bays.
Rear service and NVMe: 6 x 2.5" Gen5 NVMe hot-swap bays + 2 x 2.5" SATA hot-swap bays.
SAS expanders (Broadcom) supporting up to 12 Gb/s per port.
Rear network: 2 x 10 Gb/s LAN (Broadcom® BCM57416) + 1 x 1 Gb/s management LAN.
Integrated ASPEED® AST2600 BMC (1 x VGA) for remote management.
Expansion: 4 x low-profile PCIe Gen5 x16 slots.
Redundant power: 4 x 800 W 80 PLUS Platinum PSUs (hot-swap, redundant).
Storage & Expansion
Internal hot-swap: 60 x 3.5" SATA/SAS bays (requires storage card/expander for SAS operation).
Rear hot-swap: 6 x 2.5" Gen5 NVMe bays for high-speed cache or tiering.
Rear service: 2 x 2.5" SATA hot-swap bays for OS or service drives.
1 x M.2 (2280/22110) slot (PCIe Gen4 x4) for boot or local storage.
SAS expander: Broadcom SAS35x40; SATA 6 Gb/s or SAS 12 Gb/s per port.
Memory & CPU Details
24 DIMM slots supporting DDR5 RDIMM (12 channels per processor).
AMD EPYC™ 9005: up to 5200 MT/s (1DPC); up to 4400 MT/s (1R 2DPC); 4000 MT/s (2R 2DPC).
AMD EPYC™ 9004: up to 4800 MT/s (1DPC); 3600 MT/s (2DPC).
Networking & Management
Rear LAN: 2 x 10 Gb/s via Broadcom® BCM57416 (NCSI supported).
1 x 10/100/1000 Mb/s management LAN (BMC).
Remote management: ASPEED® AST2600 integrated BMC with VGA; supports GIGABYTE Management Console and GSM (IPMI/Redfish compliant).
Power, Cooling & Reliability
Power: 4 x 800 W 80 PLUS Platinum redundant PSUs. AC input: 100-127V~ 10A or 200-240V~ 5A, 50/60Hz (DC options in some regions).
Cold Redundancy: places one PSU in standby when total load < 40% to improve efficiency.
Cooling: 4 x 80 x 80 x 38 mm hot-swap system fans.
High availability features: SmaRT and SCMP to prevent unexpected shutdowns and protect data integrity.
Security & Optional Modules
TPM: 1 x TPM header (SPI); optional TPM 2.0 kit (CTM012) supported for hardware-based authentication and secure key storage.
User Friendliness & Deployment
Tool-less drive bay design for fast drive insertion/removal.
Designed and validated for SDS platforms; GIGABYTE reference architectures available for common SDS stacks.
Software & Ecosystem
GIGABYTE Management Console (pre-installed) and GSM (GIGABYTE Server Management) for cluster-wide management, CLI and mobile monitoring; VMware vCenter integration via plugins supported.
Ordering & Part Numbers
Ordering Number (Barebone): 6NS463Z30MR000ACB1*
Motherboard: 9MZ33AR1MR-000*
Technical specifications
Model name: S463-Z30-AAB1 (Rev. 3.x)
Chassis: 4U (434 x 176 x 853 mm)
Motherboard: MZ33-AR1
CPU: AMD EPYC™ 9005 / 9004 Series (single processor, cTDP up to 400 W)
Socket: 1 x LGA 6096 (Socket SP5)
Chipset: System on Chip
Memory: 24 x DIMM, DDR5 RDIMM, 12-channel per processor; speeds as per CPU model
LAN: Rear: 2 x 10 Gb/s (Broadcom® BCM57416) + 1 x 1 Gb/s management LAN
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.