Storage server B683-Z80-AAS1

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Overview
GIGABYTE B683-Z80-AAS1 is a 6U 10-node front-access blade server engineered for high-density enterprise deployments. Optimized for AMD EPYC™ 9005 Series (SP5) and compatible with AMD EPYC™ 9004 Series with OEM enablement/BIOS update, the platform supports dual-processor nodes and high-performance NVMe storage for HPC, private/hybrid cloud and networking environments.

Key platform / processor details

• Supports 5th Generation AMD EPYC™ 9005 Series processors (SP5 socket) and AMD EPYC™ 9004 Series processors with OEM enablement and BIOS update as required.
• SP5 platform enhancements: 3nm process, up to 192 cores per CPU, up to 512 MB L3 cache, and CXL 2.0 support for disaggregated compute architectures.

Highlights

• 6U 10-node front-access chassis delivering high compute density per rack unit.
• Dual AMD EPYC™ 9005/9004 processors per node (dual-processor nodes, TDP up to 500W).
• 24 DIMM slots per node (12-channel DDR5 RDIMM per processor) — EPYC™ 9005: up to DDR5-6400; EPYC™ 9004: up to DDR5-4800.
• 2 x E3.S Gen5 NVMe hot-swap bays per node (front hot-swap).
• 2 x Low-Profile PCIe Gen5 x16 slots per node (riser x2: one x16 from CPU_0 and one x16 from CPU_1).
• 10 x 3200W 80 PLUS Titanium redundant power supplies (system requires C19 power cord; cords not included).
• Integrated management: ASPEED AST2600 video, chassis management LAN (CMC) with front MLAN per node; supports bi-directional ring or star topologies with auto-IP detection for resilient cluster management.
• Power efficiency: automatic fan speed control and cold redundancy to improve PSU efficiency at low loads.

Product use cases
Designed for HPC clusters, networking appliances and hybrid/private cloud server farms where maximum compute density, high memory bandwidth and low-latency I/O are required. The platform is positioned for workloads demanding large core counts, accelerated memory throughput and fast NVMe storage.

Ordering
Ordering Number (barebone): 6NB683Z80DR000ACS1*

Technical specifications

• Dimensions (WxHxD, mm): 447 x 262.3 x 900 (6U 10-node front access)
• Motherboard: MZ83-HD3
• CPU: AMD EPYC™ 9005 Series and AMD EPYC™ 9004 Series; dual CPU per node (TDP up to 500W). Some PCIe/memory functions may be limited with single CPU.
• Socket: 20 x LGA 6096 · Socket SP5
• Chipset: System on Chip
• Memory: 24 DIMM slots per node · DDR5 RDIMM support · 12-channel per processor · EPYC™ 9005: up to 6400 MT/s; EPYC™ 9004: up to 4800 MT/s
• LAN: Front: 1 x 10/100/1000 Mbps Management LAN per node · Rear (MLAN board): 2 x CMC ports. Note: enable STP on switches when using ring topology.
• Video: Integrated ASPEED® AST2600 · 1 x Mini-DP per node
• Storage: Front hot-swap: 2 x E3.S Gen5 NVMe per node (connected from CPU_0)
• PCIe Expansion: Riser card x2: 1 x LP x16 (Gen5 x16) per node from CPU_0; 1 x LP x16 (Gen5 x16) per node from CPU_1
• Front I/O (per node): 2 x USB 3.2 Gen1 (Type-A); 1 x Mini-DP; 1 x MLAN; 1 x Power button w/ LED; System status LED; ID LED
• Rear I/O (MLAN board): 2 x CMC ports; 1 x CMC status LED
• Security Modules: 1 x TPM header (SPI) per node · Optional TPM2.0 kit: CTM012
• Power Supply: 10 x 3200W 80 PLUS Titanium redundant PSUs. AC Input: 100-127V~/16A; 200-220V~/16A; 220-240V~/16A. DC Input (China only): 240Vdc/16A. Requires C19 power cord (not included).
• System Fans: 10 x 80 x 80 x 80 mm
• Operating: Temp: 10°C to 25°C · Humidity: 8% to 80% non-condensing · Non-op Temp: -40°C to 60°C · Non-op Humidity: 20% to 95% non-condensing
• Weight: Net 37 kg · Gross 39 kg
• Packaging Dimensions: 1300 x 800 x 533 mm
• Packaging Content: 1 x B683-Z80-AAS1 · 20 x CPU heatsinks · 1 x Mini-DP to D-Sub cable · 1 x L-shape Rail kit
• Part Numbers: Barebone: 6NB683Z80DR000ACS1*