Rear: 4 x 2.5-inch Gen5 NVMe / SATA / SAS-4 hot-swap bays; 2 x M.2 (PCIe Gen5 x4).
Expansion: 6 x FHHL PCIe Gen5 x16 slots plus 2 x OCP NIC 3.0 (Gen5 x16).
Redundant 1+1 2000W 80 PLUS Titanium power supplies.
Key Features
Compatible with Intel® Xeon® 6 Processor family (6700/6500 series). Dual CPU design; TDP up to 300W (some SKUs up to 350W at 25°C ambient).
Memory: RDIMM up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM support for select SKUs up to 8000 MT/s (select CPUs, 1DPC).
High I/O density via multiple PCIe Gen5 lanes and M.2 Gen5 connectivity for NVMe acceleration.
Integrated management: ASPEED AST2600 BMC with dedicated management LAN and Mini-DP video output.
Designed for edge computing, networking appliances and hybrid cloud nodes.
Storage & Expansion
Rear hot-swap: 4 x 2.5-inch Gen5 NVMe / SATA / SAS-4 (configuration: 2 NVMe routed to CPU_0, 2 NVMe routed to CPU_1; SATA via I/O board where applicable).
Internal M.2: 2 x M.2 (2280/22110) PCIe Gen5 x4 from CPU_1; additional internal M.2 on I/O board: 1 x M.2 (2280) PCIe Gen5 x2 from CPU_0 (used for SATA in some configs).
PCIe expansion: 3 x FHHL x16 (Gen5 x16) from CPU_0; 3 x FHHL x16 (Gen5 x16) from CPU_1; 2 x OCP NIC 3.0 (Gen5 x16), one per CPU.
Power, Cooling & Availability
Redundant PSUs: 1+1 2000W 80 PLUS Titanium (AC and DC input options available per spec).
System fans: 4 x 80 x 80 x 38 mm with automatic fan speed control.
Cold redundancy and power management features to improve efficiency under varying loads.
Reliability features: Smart Ride Through (SmaRT), Smart Crises Management and Protection (SCMP) and dual ROM architecture.
Security & Serviceability
Optional TPM 2.0 header (SPI) and available TPM kit; PRoT connector on select RoT SKUs.
Tool-less drive bay design and OCP 3.0 serviceability for network/add-in cards.
Accessible rear I/O and maintenance-friendly component layout.
Management & Software
GIGABYTE Management Console (web) for real-time health monitoring; supports IPMI and integrates RAID/SAS/NVMe monitoring.
GIGABYTE Server Management (GSM) suite: GSM Server, GSM CLI, GSM Agent and GSM Mobile; supports IPMI and Redfish standards.
Ordering & Identifiers
Barebone ordering number: 6NE284S90DR000AAJ1*; additional part numbers and optional accessories referenced in technical specifications.
Technical Specifications
Form factor: 2U — 438 x 87.5 x 625 mm (WxHxD).
Motherboard: MS94-FS0.
CPU: Dual Intel® Xeon® 6700/6500-Series; socket: 2 x LGA 4710 (Socket E2); TDP up to 300W (select SKUs up to 350W at 25°C).
Memory: 32 x DIMM slots; DDR5 RDIMM / MRDIMM; 8-channel per CPU.
LAN: Rear I/O board with 2 x 1 Gb/s LAN (Intel® I350-AM2) and 1 x 10/100/1000 Mbps management LAN.
Video: Integrated ASPEED AST2600; 1 x Mini-DP output.
Storage: Rear hot-swap 4 x 2.5-inch Gen5 NVMe / SATA / SAS-4; internal M.2 options as described above.
PCIe: 3 x FHHL x16 (Gen5 x16) per CPU; 2 x OCP NIC 3.0 (Gen5 x16).
Front I/O: 2 x USB 3.2 Gen1 Type-A; power/ID/NMI/reset buttons; status LEDs.
Rear I/O: 2 x USB 3.2 Gen1 Type-A; 1 x Mini-DP; 2 x RJ45 LAN; 1 x MLAN; ID LED.
Security: TPM header (SPI) optional; PRoT connector on select SKUs.
Power: 1+1 2000W 80 PLUS Titanium redundant PSUs. AC and DC input options per spec.
Fans: 4 x 80 x 80 x 38 mm.
Operating: 10°C to 35°C; humidity 8% to 80% non-condensing.
Weight: Net 16 kg; Gross 25.3 kg.
Packaging: 987 x 594 x 282 mm. Contents: 1 x E284-S90-AAJ1; 2 x CPU heatsinks; 1 x Mini-DP to D-Sub cable; 4 x carriers. Rail kit not included.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.