Storage server G4L4-SD3-LAX7

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Overview
HPC/AI Server designed for intensive AI and HPC workloads. 4U chassis integrating dual Intel® Xeon® 6700/6500-series processors and liquid-cooled NVIDIA HGX™ B300 with an 8-GPU SXM configuration. Emphasizes GPU-to-GPU bandwidth, high-performance networking, dense memory support and power redundancy.

Key features

• Liquid-cooled NVIDIA HGX™ B300 modular GPU solution with 8 x SXM GPUs
• CPU + GPU direct liquid cooling solution with leak detection
• 8 x 800 Gb/s OSFP InfiniBand XDR or dual 400 Gb/s Ethernet GPU networking ports via onboard NVIDIA ConnectX®-8 SuperNIC
• 1.8 TB/s GPU-to-GPU bandwidth via NVIDIA NVLink™ and NVSwitch™
• Dual Intel® Xeon® 6700/6500-Series processors (dual-socket)
• 8-channel DDR5 RDIMM / MRDIMM support, up to 32 DIMMs
• 2 x M.2 slots (PCIe Gen5 x4 and x2)
• 8 x front 2.5" Gen5 NVMe hot-swap bays
• 4 x FHHL PCIe Gen5 x16 slots (FHHL x16 from PEX89072)
• 10 x 3000W 80 PLUS Titanium redundant power supplies (hot-swap, redundant)

Product overview
The G4L4-SD3-LAX7 is built for AI training and inference and high-performance computing. It combines a liquid-cooled HGX B300 GPU module, high-speed GPU networking via SuperNICs, and robust CPU/memory capabilities to address demanding data center AI workloads. The platform supports front-access maintenance features and flexible PSU configurations for enterprise deployments.

High Performance
Supports NVIDIA HGX™ B300 with expanded HBM3E memory capacity and integrated high-performance networking via NVIDIA ConnectX®-8 SuperNICs, delivering substantial gains for reasoning and large AI models.

Power efficiency & cooling
CPU+GPU direct liquid cooling design to reduce fan count and system noise while improving thermal stability and power efficiency. Automatic fan speed control adjusts individual fan speeds based on internal temperature sensors to balance cooling and power usage.

Hardware security
Optional TPM 2.0 module support via TPM header (SPI interface) for hardware-based authentication and secure storage of keys/certificates.

User friendly / Serviceability
Front-access motherboard and GPU trays, tool-less drive bay design, full-height add-in card support, and hot-swappable redundant PSUs enable streamlined maintenance and flexible deployment options.

High availability & resilience
Features Smart Ride Through (SmaRT) to maintain availability during brief AC power interruptions, Smart Crises Management and Protection (SCMP) to avoid unexpected shutdowns on PSU faults, and dual ROM architecture for BMC/BIOS redundancy and recovery.

Server management
Includes GIGABYTE Management Console pre-installed for real-time health monitoring and management; supports IPMI/Redfish standards. GIGABYTE Server Management (GSM) suite available for cluster management, CLI, agents, mobile app and VMware vCenter plugin.

Ordering information
Ordering Numbers: 6NG4L4SD3DR000LAX7*

Caractéristiques / Spécifications techniques

• Dimensions (WxHxD, mm): 4U
  447 x 175.3 x 900
• Motherboard: MSB4-PE3
• CPU: Dual Intel® Xeon® 6700-Series or 6500-Series processors; dual-processor, TDP up to 350W. Note: If only 1 CPU is installed, some PCIe or memory functions may be unavailable.
• Socket: 2 x LGA 4710 (Socket E2)
• Chipset: System on Chip
• Memory: 32 x DIMM slots; supports DDR5 RDIMM / MRDIMM; 8-channel memory per processor; RDIMM up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM up to 8000 MT/s. Note: MRDIMMs supported only on select Intel® Xeon® 6 SKUs and under specific configurations.
• LAN: Front I/O board: 2 x 10 Gb/s LAN (1 x Intel® X710-AT2) + 1 x 10/100/1000 Mbps Management LAN; Rear: 8 x 800 Gb/s OSFP InfiniBand XDR or dual 400 Gb/s Ethernet for GPU networking via NVIDIA ConnectX®-8 SuperNIC; Rear (MLAN board): 1 x 10/100/1000 Mbps Management LAN. Note: when both MLAN ports connected, front MLAN is default.
• Video: Integrated ASPEED® AST2600; 1 x VGA port
• Storage: Front hot-swap: 8 x 2.5" Gen5 NVMe (NVMe from PEX89072). Internal M.2: 1 x M.2 (2280/22110) PCIe Gen5 x4 (from CPU_1), 1 x M.2 (2280/22110) PCIe Gen5 x2 (from CPU_1)
• Modular GPU: Liquid-cooled NVIDIA HGX™ B300 with 8 x SXM GPUs
• PCIe Expansion Slots: PCIe Bridge Board x2: 4 x FHHL x16 (Gen5 x16) from PEX89072. Note: ambient temperature limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNICs are installed.
• Front I/O: 2 x USB 3.2 Gen1 Type-A, 1 x VGA, 2 x RJ45, 1 x MLAN (default), power button with LED, ID button with LED, NMI, Reset, storage activity LED, system status LED
• Rear I/O: 8 x OSFP ports; MLAN board: 1 x MLAN port
• Security Modules: 1 x TPM header (SPI) — optional TPM2.0 kit available
• Power Supply: 10 x 3000W 80 PLUS Titanium redundant PSUs (hot-swap). AC Input: 115-127V~/14.2A 50-60Hz; 200-220V~/15.8A 50-60Hz; 220-240V~/14.9A 50-60Hz. DC Input (China): 240Vdc/14A. System requires C19 power cord.
• System Fans: PCIe slots cooling: 2 x 80 x 80 x 56 mm
• Operating properties: Operating temp 10°C to 35°C; Operating humidity 8% to 80% non-condensing. Non-operating temp -40°C to 60°C; Non-operating humidity 20% to 95% non-condensing. Note: when relative humidity >50%, coolant inlet temperature must be higher than dry-bulb temperature and not exceed 45°C to avoid condensation.
• Packaging dimensions: 1300 x 800 x 444 mm
• Packaging content: 1 x G4L4-SD3-LAX7, 4 x Carriers, 1 x L-shape rail kit
• Part Numbers: Barebone with NVIDIA module: 6NG4L4SD3DR000LAX7*; Motherboard: 9MSB4PE3UR-000*