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Ultraviolet laser cutting machine HDZ-UVC3030UV laserfor compositesfor plastics
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Characteristics
- Technology
- ultraviolet laser, UV laser
- Material
- for plastics, for resins, for composites
- Product handled
- for PCB, for printed circuit boards
- Control type
- with control software
- Associated function
- profiling, trimming
- Applications
- for the electronics industry
- Phase
- single-phase
- Configuration
- bench-top
- Other characteristics
- high-precision, high-performance, with water cooling, programmable, with CCD camera, with galvanometric head, with optical registration
- X travel
300 mm
(11.81 in)- Y travel
300 mm
(11.81 in)- Laser power
Max.: 60 W
Min.: 20 W
- Repeatability
0.02 mm, 0.05 mm
(0.0008 in, 0.002 in)- Overall length
1,000 mm
(39 in)- Maximum width
1,100 mm
(43 in)- Height
1,750 mm
(69 in)- Power supply
220 V
Description
Machine features
Applications
Technical data
Equipment model | HDZ-UVC3030 / HDZ-UVC3030B
Laser generator | UV (green nanosecond or UV picosecond)
Laser power | 20–60 W (options)
Minimum line width | 0.03 mm
Repeat positioning accuracy | ±0.02 mm / ±0.05 mm
Maximum processing area | 300 × 300 mm
Positioning system | Visual camera (CCD) positioning
Cooling method | Water cooling
Dimensions | 1000 × 1100 × 1750 mm
Specifications
- Self-developed high-performance UV laser generator with very small heat-affected zone, enabling efficient processing of high-density, highly integrated PCBA/FPCBA products.
- High-precision motion system with Scanlab galvanometer and visual camera positioning to ensure cutting accuracy.
- Proprietary control software supporting multi-panel cutting, automatic focusing, distortion compensation and batch programming for complex layouts.
Applications
- Precision cutting, half-cutting and grooving of FPCBA, PCBA, RF materials, CVL and SIP.
- High-quality cutting of coverlay, PI, FR4, FR5 and CEM materials.
- Fine processing of electronic components such as mobile fingerprint modules, camera modules and integrated circuit chips.
Technical data
Equipment model | HDZ-UVC3030 / HDZ-UVC3030B
Laser generator | UV (green nanosecond or UV picosecond)
Laser power | 20–60 W (options)
Minimum line width | 0.03 mm
Repeat positioning accuracy | ±0.02 mm / ±0.05 mm
Maximum processing area | 300 × 300 mm
Positioning system | Visual camera (CCD) positioning
Cooling method | Water cooling
Dimensions | 1000 × 1100 × 1750 mm
Specifications
- Model: HDZ-UVC3030 / HDZ-UVC3030B
- Control system: Scanlab galvo scanner + control board, Windows-based
- Wavelength: 355 nm
- File formats: DXF, PPLTLT
- Power supply: 220 V / 50 Hz (consult options)
Other Han's Laser Technology Co., Ltd products
Wafer & PCBA Laser Cutting Equipment
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.