UV laser cutting machine HDZ-UVC3030

for PCBsingle-phasehigh-performance

1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With high-precision CCD positioning system. 1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product 2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing 3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high 4. The high-precision CCD positioning system can ensure the product’s processing precision. Application Field: 1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP 2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials 3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.